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HTS code reference›Chapter 84: Nuclear reactors, boilers, machinery and mechanical appliances›8480.71.40.00

HTS Code 8480.71.40.00

For the manufacture of semiconductor devices

Official tariff path

Molding boxes for metal foundry; mold bases; molding patterns; molds for metal (other than ingot molds), metal carbides, glass, mineral materials, rubber or plastics: › Molds for rubber or plastics: › Injection or compression types: › For the manufacture of semiconductor devices

Level: statistical10General duty: FreeUnit: No.

What does HTS 8480.71.40.00 cover?

This provision appears in the 2026 Harmonized Tariff Schedule of the United States under the following legal tariff hierarchy. A product must match the wording and applicable section or chapter notes before this code is used on an entry.

  1. 1Molding boxes for metal foundry; mold bases; molding patterns; molds for metal (other than ingot molds), metal carbides, glass, mineral materials, rubber or plastics:
  2. 2Molds for rubber or plastics:
  3. 3Injection or compression types:
  4. 4For the manufacture of semiconductor devices

Nearby tariff provisions

8480.71.10.00For shoe machinery8480.71.80Other
Official source and limitations

Based on USITC HTS 2026 Revision 12, published July 21, 2026. The general rate does not include every origin-specific program, Section 301 or 232 measure, antidumping or countervailing duty, quota, or other agency requirement.

Open this code in the official USITC search ↗